Board

 https://www.tindie.com/products/miceuz/low-power-lora-i2c-rs485-node/

U.FL connector footprint

(note the tab on the top is raised and should not be soldered, and the center pad should not short across the cut gap)

Trace cutting and scrape pattern

(after tinning and wicking for flatness. Some more stop mask came off due to the force with which the wick was pulled over the pads, but this may be rectified when soldering the connector with flux paste. Make sure not to cut into the inner layers. Cutting technique:

• score two lines in between which the cut will happen
• angle exacto knife blade at 30-45° w.r.t. surface, stab a small point into the copper layer, roll blade by 45-60°
• repeat to create a perforated line
• do more passes to fully sever the outer copper
• repeat for second line
• lift off the strip in the middle
• optionally shave the edges with the blade while minimizing smear )

Finished modification