Some time ago i stumbled upon Robert "Bob" A. Pease's publications. He really deserves self-proclaimed title "czar of bandgaps" - every article is worth reading if you are into analog electronics. Nonetheless one of his statements was that IC's made in BiFet technology are very susceptible to mechanical stress during operation. I dig deeper and found more articles about semiconductor manufacturing that matching tempco material of package vs silicon is crucial when producing precision op-amps as mechanical stress is causing internal offset deviation between transistors.

At this point i didn't have any doubts - this effect is real. But can it be leveraged to build weight scale based on this effect?