tiny form factor I²C/SPI breakout board for BMI160 (acceleromete r+ gyro) with a tiny BMM150 connected to the secondary I²C interface of the BMI160. The latter provides register mapped access and FIFO buffers for all 9 axes.
State of the art MEMS sensors, lower operating current than BMA280 + BMG160 and additionally simultaneous acc+gyro sampling.
Works with <=3.3V only
some boards have been built and sent to friends to play around with.
Depending on who makes your PCBs, the NSMD (non-solder-mask defined) lands for the staggered BGA package will or will not work. for NSMD you'd usually have more stopmask recess around the pads. Since these boards are really cheap to make I ordered a lot of them and graded them under a microscope.
If your PCB manufacturer uses a maskless process, chances may be better that the lands are well-defined.
I'm not sure if I have PCBs left somewhere. Since they are cheap these days and the BGA pads are more or less solder-mask defined, I visually inspected them and tossed a few with inadequate stop mask alignment.
I did however use the same footprints on another sensor board with good yield. Hope that helps.
Yes that helps. I will order three from https://aisler.net/ (minimum) and use a solder paste syringe and a hot plate to bake it. I learned a few things at 35c3 ;)
You don't use 4.7k pull-up for i2c between bmi160 and bmm150 ?