After a failure in one of the pads, they need a redesign to make it more modular and resilient. The new design uses a single piece of neoprene for the base, which will incorporate all pads (instead of 4 unique ones, which need to be placed correctly on the board. After experimenting with other wire shapes, we are continuing with the conductive thread zig-zag, in order to have consistent resistance to the original design. This negates having to push a software update.

The thread will be soldered using crimp beads in order to create a stronger mechanical bond - this is likely what failed in the previous design. I expect to have the original pads back in a week or two and will tear them down to find the failure.