The second PCB Revision was assembly and it is currently deployed and reporting the temperatures from 4 bins. Some things have been learned and have to improved again.

The two that come to mind are:

1. A guide for pull-up resistor values need to be made. The standard 4.7K ohm does not work for the two bins I have further away from the MKR 1010 since the capacitance of the wire grows with length an that capacitor (the wire) has to be charged to transmit a 'high' voltage signal. If the resistor is too large the 'capacitor' will not be charged in time. I will give a more detailed description in some sort of document being that a log or a tutorial, but it will be done.
2. Not pertaining to the PCB the distance of the temperature sensors need to be changed to give better/more usable temperature readings of the grain temperature. Either 4 will be placed 4 feet apart or 3 will be placed 5 feet apart, as opposed to 3 placed 7 feet apart.

I think there is some PCB changes that I am forgetting to mention, but I will add them after I review my PCB assembly video.