I started from scratch with the routing.
A fresh start is nice. I don't see any issues with the layout of the components, so this change shouldn't be too bad. Generally with the layout, there are a few major sections.
The package size is honestly for ease of assembly, if I were producing this board for myself, they would be 0402 sized ceramic capacitors, so to avoid increasing the total ESL, I've packed them.
If you're curious about this topic, it's worth looking into the frequency domain of capacitor impedance:

¯\_(ツ)_/¯
Anyway, that's why the via's are splattered around the IC instead of running most of the board on one layer. I physically cannot get traces out of the extremely tight capacitor arrays.
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