So I've been thinking of how I was going to do this for a while, such as the geometry and feature order. The first thing I did was research how heatsinks have been designed by others, and what I could gather is that they a) make sure that it's printable geometry, b) they usually use lattices and c) add fillets to prevent sharp edges.

Part a sounds obvious, but it means that I'm unlikely to be able to use a standard hotend design (see below) considering that I intend for PCBway to print upside-down.

Just like with an FDM printer, those overhangs wouldn't print. If anything, DMLS is even less tolerant of overhangs than FDM.

But other than that limitation, it doesn't seem like there's any general best-practice for this kind of thing short of CFD so I had to come up with my own solution. Well, I finally looked into designing something after days occasionally thinking about it and the idea I had come up with was reduced to atoms when I got here: