So the plan I have for the heat sinking main conductors that attach to the bottom pads of the IC chip I decided to draw up to explain it. It will be in layers. First you have the chip on the bottom facing bottom side up so the pads are exposed upwards. Then on the first attachment layer I cut out matching shaped copper plates from copper sheeting and solder that down with low temp solder paste and a soldering iron. In theory, this first layer attachment will basically just be extending the pads up past the viewing window of the DIY PCB with cutout viewing window we've made so far so that the DIY PCB we made so far and this first layer of copper plates together act as layer 1. Ideally the copper plates would be slightly proud of the printed PCB in height I think. This first layer copper plates that we are soldering onto the pads of the IC carries the current and the heat sinking to layer 2 without the need for vias. In a multi-layer PCB made industrially, vias would take the heat sinking and current to layer 2 of the board and we are just using solid copper plates instead which should be even better than vias because its solid copper instead of just via holes so more surface area than vias would offer. Now on layer 2 we can create a much larger sheet that extends out past the PCB way off the chip and that portion that extends way off the chip acts as a tab we can solder the V- wire to. It also acts as a tab we can solder our 6 strands of solder wick wire that act as heatsink fins to. Layer 2 also has a plate that brings the V+ to layer 3. For layer 3 we just attach a large sheet of copper which also extends way out past the chip and acts as a tab we can solder our V+ wire to and our heatsink solder wick wires to.