There are other ways to embed ICs inside fibers. A materials science group called "Fiber @ MIT" has been using the optical fiber process, but it requires special machines:

https://pbg-rle.mit.edu/our-fibers/

We propose to use common manufacturing processes that enable customization and scalability (Flex PCB, silicon coating, braiding, etc). The process inspiration is illustrated below:

(a) an LED filament bulb, (b) an open one, (c) its LED filament made with an FPC and silicone...

...and (d) our addressable LED FiberCircuit made with a similar process, (e) our main FiberCircuit with MCU and Sensors.