First try was made as simple and quick as possible. I designed and 3D printed stand and shelf connected by carefully selected AD824 from scrap pile. This device won my casting for bending as it works happily with low voltages and have long, thin packaging. Most importantly this device is FET-based so loadcell effect should be noticeable - Bob stated that effect is strongest in BiFet devices, but other sources mentioned that FET's also are sensitive to mechanical stress.

Before gluing package was filed a little to make package more flexible.

Measurement circuit is very simple with both inputs connected to ground via 10R resistors and 10k between negative feedback to output. This gives 1001 amplification of voltage offset at output.

Unfortunately i forgot to make more photos with DMM of this stage, so just trust me that output voltage was susceptible to bending IC :)