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A project log for Five Tolerances That Matter in Class 3 Fabrication

Class 3 PCBs fail when real fabrication tolerances stack up. Drill wander, plating growth, and lamination movement decide yield.

ryan-oconnorRyan O'Connor 12/01/2025 at 17:540 Comments

Upcoming CAM and Microsection Update

I have been reviewing additional layer registration behavior and drill to copper margins on recent HDI and Class 3 builds.

The next update will include a detailed microsection comparison that connects several CAM stage decisions such as pad compensation, mask expansion, and drill offset budgeting to what appears in the finished cross sections.

The goal is to show how small adjustments in CAM influence annular ring, dielectric spacing, and final fabrication yield.

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