Just wanted to note our current settings for the boards:

• Solder Mask Swell 0.02mm
• Paste Mask Shrink 0.1mm

DipTrace via tenting issues:

• Via: 13mil drill and 28mill outter ring
• Tent: 7mil center lined 24.5milx24.5mil X/Y ellipse should give ~.75 mil "lip" to tenting from drill - DipTrace drawing/pad ratio off (bug submitted). 6.5 is close enough.