I am updating the silk screens on all the Flex Modules so that pin names are on the bottom. This will be much more legible given the limited surface space on the module top. I am also adding about 1mm in length to the castellations that will then hold pins better and provide more soldering surface as well. In addition, I am working on getting out early audio board designs and possibly a charger design. Trying to minimize redundancy and cost between the various power and charger solutions is taking the most time. The USB BiPower module is already quite expensive and dense. Swapping to a charger/power component may be still space and cost effective depending on the inductor and miscellaneous FETs needed. Our 10-axis Flex Module is also pricey. There are lower cost solutions from ST now which will have a similar module footprint, so I may make a lower cost version of that Flex Module. It would be great to keep it the smallest 10-axis and also make it the cheapest. In addition, I'll be updating the large STM32 board with a better pin layout that is more compatible with the other Flex Modules.