Flex Modules

Just wanted to note our current settings for the boards:

• Solder Mask Swell 0.02mm
• Paste Mask Shrink 0.1mm

DipTrace via tenting issues:

• Via: 13mil drill and 28mill outter ring
• Tent: 7mil center lined 24.5milx24.5mil X/Y ellipse should give ~.75 mil "lip" to tenting from drill - DipTrace drawing/pad ratio off (bug submitted). 6.5 is close enough.

OSHPark is offering their new swift service for free this weekend.  So we decided to send an order out for every board we thought was ready (and rushed to ready others as well). Hopefully we see improved results with the new tenting method in DipTrace.  If it works, I'll put together a how-to to produce thermal vias, custom paste, and solder mask layers in 2.4 DipTrace.