Designing the sensor board took me more time than expected which in combination with surprisingly fast delivery of temperature/humidity case with protective shell meant that the case arrived before I sent the boards to production.

A rainy Saturday was spent basically on: printing the 3D model of PCB, checking if it fits, fixing the shape of PCB, exporting 3D ... REPEAT

The final version of board is at widest 11.8mm wide which is less than 12mm inner diameter of sensor casing and more than the module width of 11.6mm.

Following the "improvement" of the shape was modification of all the connections and components to meet new space restrictions.

There is also an image of final PCBs Top and Bottom in the project gallery.