Here´s the overview of the hardware modules. It´s very straightforward and exchangeable.
The inverter in version 1.0 was underdimensioned and got hot. The new inverter is doing the job much better. For the vacuum tests, I heatsinked the inverter mosfets directly to the chassis. There is also an additional heatsink thermally bonded to the inverter transformer core which will sink the heat to the chassis. Electrolytic caps are potted in epoxy to avoid eventual burst inside the vacuum chamber.