As most of the components already arrived (and I want to win the Bulbdial Clock this week), I decided making the first run test of my device. This was not the first time that I soldered SMD components but it was the first time I soldered one with a TQFP-32 pin package, and I must say, it was easier than I thought, even without seeing much because of the size (my new glasses with magnifying lenses is still on the way).

After soldering the main components and some others that I will not use by now, I hook up my device via ICSP to my Arduino Mega 2560 to burn the bootloader.

Luckily all worked as expected in the first trial.
Very satisfactory, huh?