Well, gave the skillet method a try. For those unfamiliar: https://www.sparkfun.com/tutorials/59.

Basically, I put solder paste (lead free in this case) down on each of the SMD pads using the syringe, placed all the SMD components, popped it all onto a frying pan (old one), and heated it on the stove until the solder paste reflowed. From beginning to end it took maybe 15 minutes, so certainly fast. I'd have to say probably easier than the half soldering even, and the result are slightly better I think. The reflow took much less time than I expected; maybe 2 to 5 minutes at most from cold to reflow.

And it all works as expected still. I think this is the method I'll be using for most SMD work going forward; not when I have only a couple of basic components, but whenever I have a lot or multi-lead ICs and such. For those who might knock me for not hand soldering everything, this is the method I'm comfortable with; your mileage may vary.