If you have some experience with Eagle and would be willing to spend some time putting together 5cm x 5cm and 10cm x 10cm panel BRD files for DirtyPCB fabrication, I would much appreciate the help. Drop me a comment here.
A project log for SMT to DIP Breakout Boards
Eagle files used to convert SMT chips to DIP format for use in breadboard prototyping.
If you have some experience with Eagle and would be willing to spend some time putting together 5cm x 5cm and 10cm x 10cm panel BRD files for DirtyPCB fabrication, I would much appreciate the help. Drop me a comment here.
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Stefan,
No worries. I'm not an expert either! Thank you for these panels.
The 100x80 is a good variety pack. I think I'm going to send it off for fab to see how it works out. I'm debating about going the variety route or making panels of each type. Maybe I should just do both to accommodate cases where someone only needs 1 type of board. What are your thoughts?
Looking at the boards from DP. I'm not sure how they could be used on a breadboard with QFP pins on the top and bottom. Maybe I'm missing something?
Are you sure? yes | no
I was suggesting to use a QFP/TQFP footprint like those from DP on a DIP board. Contacting the bottom pad or avoiding shorts with it might be an issue but might also be easily fixed with some kapton tape.
Regarding the choice of panels, I think that a 50x50 panel with two boards for multiple packages would be the best (and cheapest to cover most cases). Since you get 10+ pieces from DirtyPCBs you might as well just use a SOIC28 for a SOIC8 chip. If you get a board with only TSSOP breakouts for example you might end up never using one kind.
Are you sure? yes | no
Hi Kevin, I gave it a shot:
https://www.dropbox.com/sh/8ta91we3t0pd6e3/AAB_BTHhjN-HtYPGC_cqJ_wFa?dl=0
I'm not an expert but I used the same technique as I did for #Pro Trinket USB Keyboard where I had the PCBs made by DirtyPCBs, too, and it worked out great. I used EAGLE 6.6.0 for compatibility and ran their DRC without errors. Since I only have the freeware the max size is limited to 100mm by 80mm which is enough for all boards to fit but it's not completely optimized. For the 50mm one I chose the largest QFN/TQFP and SOIC/TSSOP packages that would fit since you could also use a SOIC20 board for a SOIC8 chip if you needed. For the QFP breakouts on a 5cm*5cm board it would be better to use a foot print like this: http://dangerousprototypes.com/docs/Dangerous_Proto_boards
Let me know what you think.
Are you sure? yes | no