Wouldn't this put the device somewhat out of spec?

Wouldn't it be simpler and easier to use the SOIC version if you need it to be less chunky?

Or couldn't you select a different part that's equally well supported? The BMP180 for example is tiny, and has air pressure as a bonus.

Not saying shaving components when you're in a hurry isn't an option (I've shaved many an LED to fit into places) - just not an ideal thing to do if you can order a part.

Totally out of spec! But its a very convenient case to add wires to and e. g. put it in a bee hive. It's called hack for a reason, right? :) 

I use Si7021 as well, much quicker conversion and humidity included. 

But not watertight as Ds18B20s are... 

LOL - Hacked with a hack saw is what it looks like   ;-)

@Tin feel free to replicate this on your horizontal-surface grinding machine. I used a small hand file by the way. Not exactly easy to get perfectly angled cuts that way...

This is great information!  Thank you!

The biggest problem I've had with DS18D20s is that, if you are measuring temperature a lot higher / lower than ambient, the case and leads connected to the sensor will tend to introduce stem effects that can make temperature readings off by a few degrees.  

Being able to make a good thermal connection to the copper tab should help with this a lot.  

Another thing I've been doing is putting 50 mm - 75 mm of Dumet wire between the sensor and the copper leads I use to connect the sensor to my electronics.  Dumet is an Iron / Nickel alloy that has a 10th the thermal conductivity of copper.  These two design details should make for some really accurate DS18D20 temperature measurements.

Thanks for that! Havent recognized that behavior yet. I have to look into that. I really wonder, because it's a digital data transfer...