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Update
09/19/2019 at 00:42 • 0 commentsIt has been too long, but I finally got all the connectors on the board. There are pictures in the gallery. Stay tuned for testing performance.
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SMA Connector Layout
07/18/2019 at 03:44 • 0 commentsSMA connectors are quite common for high speed interconnect in applications like this and you would think there would be plenty of app notes or examples to copy, but I was surprised how difficult it was to find a suitable reference to copy. I did find some information online to point me in the right direction. One issue I wanted to address was the fact that the pad for the signal pin is significantly wider than the trace width for a 50 Ohm trace. This article by Dr. Howard Johnson describes some techniques to deal with this ( http://www.sigcon.com/Pubs/edn/TaperedTransitions.htm ) I'm not going to go full tapered, but I did round the pad and cut away a little off the plane below to reduce the effect of the transition.
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The Tool
07/18/2019 at 03:11 • 0 commentsThe lazy engineer in me has become a little too dependent on upverter and they have recently hosed me with their major system update that left several of my projects stranded, so I am finally making the long overdue effort to wean myself off and switch to KiCad.
One of the techniques I want to use is curved traces which should make the impedance more consistent, especially since I won't necessarily be able to hit it perfectly. I discovered that KiCad does not support curved traces, but fortunately Seth Hillbrand presented a technique to work around this at KiCon. It is a bit of a kludge and a little painful but usable for the number of corners I need. It sounds like real support for curved traces is coming to KiCad, so we shouldn't need to do this much longer.
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Project goals and strategy
07/18/2019 at 03:05 • 0 commentsThe purpose of this project is to build a USB Type-C breakout board to facilitate the evaluation of boards designed to utilize the super speed differential pairs. This is intended to be a cost effective alternative to the commercial breakout boards. To keep this accessible to makers, I am designing this to be fabricated at OSHPARK to see what performance I can get with there standard 4 layer stackup. I'm designing the board to be as small as possible to keep the price down and the traces short. It should be a little easier to keep the traces short and matched now that vertical plugs are available ( https://www.digikey.com/product-detail/en/jae-electronics/DX07VN24WA2C1568/670-3103-ND/9695489 ) I don't have access to 3D field solvers, nor the time or patience to use them, so I will take be using my best engineering judgement, over-design a little and use every rule of thumb I can find.