This is a small anodic bonding unit I recently built for my home lab. It's a tool use to hermitically bond layers of glass to silicon. I'm using it with some of my other tools to create MEMS devices. The device consists primarily of an aluminum hotplate, temperature controller, and HV source. The hotplate is wired with 4 x 120W plug heaters and a thermocouple to measure temperature. There are 2 separate HV channels (380VDC and 1500VDC ). The 2 switches control HV on/off and the second switch controls the 380/1500 option. Smaller aluminum plates are used as the electrodes. I use some broken aluminum oxide sheets as insulators. I place some bolts on top to act as a clamp with another aluminum plate.