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2023-01-14 22.21.15.jpg
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2023-01-14 22.22.04.jpg
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2023-01-14 22.18.53.jpg
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2023-01-15 00.00.22.jpg
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2023-01-14 22.21.40.jpg
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2023-01-15 00.01.44.jpg
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2023-01-14 22.21.38.jpg
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2023-01-14 22.15.13.jpg
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2023-01-15 00.01.31.jpg
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2023-01-15 00.00.45.jpg
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2023-02-07 21.56.21.jpg
Here is the anodic bonder unit with a piece of borosilicate glass and silicon sandwiched between the alum oxide insulators, electrode, and plates. A typical bonding session will be at ~400C and around 1000 VDC for 30 mins.
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2023-01-24 22.12.11.jpg
Before I put in the clamping system - I was stacking weights on top
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2023-01-18 20.52.57.jpg
Wiring was pretty straightforward. It's 120V system for the heater controller. The heater controller is connected to the heating plugs, a mosfet to control the power, and a thermocouple.
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2023-01-24 21.28.28.jpg
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2023-01-18 21.38.02.jpg
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2023-01-18 23.15.07.jpg
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2023-01-18 23.49.42.jpg
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2023-01-18 20.57.47.jpg
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2023-01-18 20.50.00.jpg
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2023-01-18 19.02.35.jpg
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2023-01-24 21.11.01.jpg
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2023-01-24 21.10.52.jpg
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2023-01-24 21.09.54.jpg
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2023-02-07 21.56.29.jpg
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2023-01-23 20.35.41.jpg
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2023-01-31 20.32.32.jpg
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2023-01-25 21.23.49.jpg
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2023-01-23 19.23.42.jpg
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2023-01-24 21.15.08.jpg
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2023-01-23 19.20.56.jpg
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2023-01-25 21.22.32.jpg
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2023-01-24 21.15.29.jpg
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2023-01-25 21.22.21.jpg
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2023-01-24 22.15.57.jpg
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2023-01-18 23.49.46.jpg
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2023-01-24 21.15.16.jpg
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Anodic1.jpeg
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Schematic-of-anodic-bonding-configuration-devices-One-of-the-well-known-problems-with.ppm
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23.24 kB -
02/08/2023 at 03:08
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2023-01-25 21.22.08.mp4
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02/08/2023 at 03:08
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2023-01-25 21.22.08-1.mp4
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02/08/2023 at 03:08
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Steve Hernandez