My plan is to use a 3d printed case to provide a weather-resistant barrier to protect the internals of this device. I have very little experience with 3d printing, so this is one of my weak points in this project. I have already printed out a prototype of one side, and it did not come out well. It ended up being unusable because it warped and did not accomodate the Pi's mounting holes. I'm attaching a picture here of that, as well as of the next version's design.

I have some theories as to why it failed.

1) Issues with setup of the university's 3d printer

2) Heated bed did not activate or was not turned on in the slicer, resulting in uneven cooling that caused the flat design to warp.