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Layout updates
08/31/2015 at 00:13 • 0 commentsAt some point in the future I'll be switching pins again. The i2c was always laid out different from the other Flex Modules. This R 2.0 version will flip the DRV2605 and that allowed me to fix this. I have about 2 dozen R1.0-1.1 LRA Haptic Flex Modules to sell before they are made and I'll keep the documentation referencing them and add the new design info when the R2 are ready.
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Redesigns
08/17/2015 at 17:07 • 0 commentsWe just swapped to a 2 layer design. It seems to be very good and we lowered the parts count while making space for the i2c pull-up solder bridge. We might need to redo the pin layout yet again. This still isn't right compared to the other Flex Modules...
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i2c update
02/18/2015 at 17:43 • 0 commentsSwapped VDD/GND to be consistent with other i2c Flex Modules. Also the font on the bottom has been increased to 4, hopefully it looks better. Still working on a panelization solution for this board.
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Update pictures
12/18/2014 at 03:01 • 0 commentsI have mostly discussed this project on the main Flex Modules project log. I just updated pictures with the new board designs. We are still working to optimize silkscreens and the next batch should be even better.
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Testing design
09/04/2014 at 06:22 • 0 commentsI got a pretty good flow with hot air, hand solder paste, and hand flux paste placement on the board. The boards looked great as far as a tented via just a little bigger than the BGA pad and very centered/circular. I'll now see if they can speak I2C OK or not.