1. First cut out a rectangular piece from a single sided copper clad board which is slightly larger than the PCB dimensions and file off the sharp edges.

2. Rub off the impurity layer from the copper with a metal scrubber (till its shiny) and clean it afterwards with alcohol (IPA).

3. Apply photo resist film on the cleaned PCB

4. Place the negative photo mask of the bottom copper layer on top of the film and keep the board along with the film and mask in between two glass slides so that the mask sits evenly.

5. Expose the film under UV light (time depends on your UV light strength, I use a nail polish hardener and it takes me 1 min).

6. peel off the second protective layer from the film and dip the board in developer solution

7. After the board has successfully developed etch the board in FeCl3 or whatever you use.

8. Clean it up and apply UV curable solder mask paste (or if you have film .... I'll take it off your hands) and place an OHP sheet over it to even it out.

9. Place the transparent solder resist mask and expose for a longer time (it takes me 8 mins).

10. Peel off everything gently and wash the board with alcohol, it will remove the solder resist paste from pads and vias, sometimes it requires rigorous cleaning, don't be afraid to put some pressure.

11. Drill the holes...................Done !