• The exposed pad is connected to pin 3 GND internally. The two capacitors can be soldered directly from the exposed pad to pins 2 and 7 for decoupling. 
  The crystal can be soldered directly on pins 4 and 5. 
• The LED can be soldered between pin 1 and the exposed pad. 
• The antenna can be soldered on pin 6.
• The FTDI connection GND pin can be soldered on the exposed pad for support, and the 3.3V, TX, and RX can be connected with wire.

I used high viscosity UV glue to pot the whole circuit for protection.