The Engineering Framework:
• The Chassis: A tight, custom-designed, linear wind-tunnel enclosure generated via Boxes.py and modified in Inkscape. Constructed entirely from 3mm plywood stock with high-efficiency, laser-cut IP1x geometric honeycomb exhaust grids to drop structural backpressure down to absolute zero.
• The Aerodynamics: Driven by a large 5V 4-pin PWM centrifugal turbine blower harvested from an Intel NUC6 "Skull Canyon" platform. The blower sits flat at the intake channel, drawing ambient air from the chassis floor and projecting a high-velocity laminate sheet horizontally down the runway of the tunnel.
• The Thermal Stack: The restrictive, low-profile stock laptop assembly has been completely desoldered. The new thermal stack features the original pure copper lateral heat-spreading adapter layer, bedded with Honeywell PTM7950 phase-change material, topped by a massive aluminum heatsink for M.2 SSDs. Large thermal capacity coupled with extended surface area is hoped to help achieve lower temperatures and noise.
• The Firmware Exploit: Standard factory BIOS restrictions are bypassed using the EDK2-based Smokeless_UMAF (Universal AMD Form Browser) tool. VRAM will be vastly extended beyond stock 512MB. With enhanced APU thermal management, it may be feasible to un-throttle the long-term package power tracking (PPT) boundaries from 15W up to a sustained 25W–30W envelope. Fan control will also receive custom tuning.