Re-creation of Mike's https://hackaday.io/project/162054-shift-register-for-supercon-badge using a surface mount version of the 595 IC chip. I'm using the original Front/Back Copper layers from Voja's Gerbers and adding the surface mount pads for the IC's and discrete 0805/SOT-23's.
I would recreate the entire layout, however I don't know that there is a better way to generate the 0.1" prototyping grid, and I'll probably eliminate most of the drill holes to make it easier to mill.
Laser cut 1:1 size board references. These two cuts were generated from new outlines based on the actual badge. The files are available as .dxf and .svg. These were done to sanity check the process of creating new expansion boards that would be compatible. Also with these I can actually hold the "board" in my hand and get a feel for the form factor and usability.
The "outputs" of what looks like the production version of the PCB's for both badge and expansion were posted to the official badge project, the zips contain a sub-folder with gerber files.
In the process of converting the gerber files into a KiCad board file, you will get the following layers doing "Open Gerber Files...". Note that these leaves out a number of layers that use other file extensions naming conventions. The "Outline file was manually imported by selecting the "*.*" file type option.
The mapping to KiCad layer names is shown after the Gerber convention. This comes in hand when using the Export to Pcbnew from Gerber viewer.
Also note that for whatever reason when I converted the *.Outline to Edge.Cuts, I got a duplicate outline of one on top of the other, which just caused the laser cutter to cut the same path twice.
Added scaled reference image, rotation and scale is corrected, there is still some skew, particularly from top to bottom along the sides. The image resolution is adjusted to 640 pixels per inch in GIMP, this results in the 0.1" hole spacing equating to 64 pixels. Also added some transparent PNG's that were pulled and scaled from data sheets as basic references for assessing footprints.